数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  



PACKAGE 数据表, PDF

KEC(Korea Electronics)(406)Kemet Corporation(3)Kersemi Electronic Co., Ltd.(122)Keysight Technologies(1)Kingbor Technology Co(1)Kingston Technology Far East Co. Ltd(1)KOA Speer Electronics, Inc.(2)KODENSHI_AUK CORP.(51)KR Electronics, Inc.(5)Kyocera Kinseki Corpotation(1)Laird Tech Smart Technology(1)Lattice Semiconductor(1)Leshan Radio Company(48)LETEX TECHNOLOGY CORP.(1)LIGITEK electronics co., ltd.(1)Linear Dimensions Semiconductor(1)Linear Integrated Systems(2)Linear Technology(34)Linx Technologies(3)List of Unclassifed Manufacturers(54)List of Unclassifed Manufacturers(96)Lite-On Technology Corporation(46)Littelfuse(22)Lowpower Semiconductor inc(10)LUMEX INC.(8)Lumileds Lighting Company(36)Luminus, Inc(1)Luna Innovations Incorporated(17)LUXPIA(2)M-System Co.,Ltd.(3)M.S. Kennedy Corporation(42)M/A-COM Technology Solutions, Inc.(32)Macronix International(4)Marki Microwave(6)Marktech Corporate(5)Maxim Integrated Products(154)Mean Well Enterprises Co., Ltd.(24)Melexis Microelectronic Systems(2)Mercury United Electronics Inc(6)MIC GROUP RECTIFIERS(1)MICORO CRYSTAL SWITZERLAND(7)Micrel Semiconductor(8)Micro Commercial Components(6)Micro Electronics(9)Microchip Technology(5)Microdc power Technology Co., Ltd(10)Microdiode Electronics (Jiangsu) Co.,Ltd.(2)Micron Technology(1)Micronas(3)Micropac Industries(8)Microsemi Corporation(22)Micross Components(2)Mimix Broadband(3)Minilogic Device Corporation Limited(1)Minmax Technology Co., Ltd.(83)Mitsubishi Electric Semiconductor(389)MMD Components(48)Molex Electronics Ltd.(12)Molex Electronics Ltd.(13)Molex Electronics Ltd.(8)Molex Electronics Ltd.(28)Molex Electronics Ltd.(4)Molex Electronics Ltd.(4)Monolithic Power Systems(41)MORNSUN Science& Technology Ltd.(45)Morse Mfg. Co., Inc.(1)Mosel Vitelic, Corp(4)Mospec Semiconductor(1)Motorola, Inc(32)MPS Industries, Inc.(5)MTRONPTI(3)Murata Manufacturing Co., Ltd(3)Murata Manufacturing Co., Ltd.(8)Murata Power Solutions Inc.(3)MUSIC Semiconductors(1)Nais(Matsushita Electric Works)(4)Nanjing International Group Co(4)Nanjing Ouzhuo Technology Co., Ltd.(2)National Semiconductor (TI)(54)NEC(29)Nel Frequency Controls,inc(9)Nell Semiconductor Co., Ltd(9)New Japan Radio(3)New Jersey Semi-Conductor Products, Inc.(18)Newhaven Display International, Inc.(2)Nexperia B.V. All rights reserved(67)Nihon Inter Electronics Corporation(3)Nippon Precision Circuits Inc(2)Nisshinbo Micro Devices Inc.(2)Numonyx B.V(11)NXP Semiconductors(81)NXP Semiconductors(52)Ohmite Mfg. Co.(14)OKI electronic componets(10)Omron Electronics LLC(27)ON Semiconductor(219)OPTEK Technologies(35)OptoDiode Corp(2)Optoway Technology Inc(23)OSRAM GmbH(1013)
More
搜索关键字 : 'PACKAGE' - 的资料共: 14813 (1/741) Pages
制造商部件名数据表功能描述
Company Logo Img
Amkor Technology
PSVFBGA Datasheet pdf image
251Kb/2P
Package on Package (PoP) Family
Company Logo Img
KEC(Korea Electronics)
KDV239 Datasheet pdf image
349Kb/1P
USC PACKAGE
KDV269 Datasheet pdf image
350Kb/1P
USC PACKAGE
KDV269E Datasheet pdf image
49Kb/1P
ESC PACKAGE
KDV269V Datasheet pdf image
14Kb/1P
VSC PACKAGE
KDV273 Datasheet pdf image
349Kb/1P
USC PACKAGE
KDZ11V Datasheet pdf image
21Kb/1P
USC PACKAGE
KDZ110VW Datasheet pdf image
21Kb/1P
USC PACKAGE
KDR105 Datasheet pdf image
21Kb/1P
USM PACKAGE
KDR331 Datasheet pdf image
21Kb/1P
USM PACKAGE
KDS121V Datasheet pdf image
12Kb/1P
VSM PACKAGE
KDS125E Datasheet pdf image
351Kb/1P
TES6 PACKAGE
KRA301 Datasheet pdf image
32Kb/1P
USM PACKAGE
KDV175 Datasheet pdf image
349Kb/1P
USC PACKAGE
KDV214A Datasheet pdf image
349Kb/1P
USC PACKAGE
KDV214V Datasheet pdf image
14Kb/1P
VSC PACKAGE
Company Logo Img
CITIZEN ELECTRONICS CO....
CL-L430-MC1W1-A-T Datasheet pdf image
404Kb/12P
LED package
Company Logo Img
Zentrum Mikroelektronik...
MDS735 Datasheet pdf image
127Kb/1P
Package PDIP28
MDS748 Datasheet pdf image
154Kb/1P
Package SOP14
Company Logo Img
KEC(Korea Electronics)
KDR322 Datasheet pdf image
21Kb/1P
USM PACKAGE

1 2 3 4 5 6 7 8 9 10 > >>


1 2 3 4 5 > >>



什么是 PACKAGE


在电子零件中,包装是指用于保护和连接设备的外壳或包装。

软件包在保护和连接设备中起着重要作用。

如果设备没有适当保护,则环境影响会损坏或破坏设备。

软件包有各种形状和尺寸,并且根据设备的类型和目的有各种类型。

代表性软件包包括DIP(双线内软件包),SOP(小型外线包),QFP(QUAD FLAT软件包)和BGA(Ball Grid Array)。

DIP是更具代表性的包装之一,并在线放置了两个引脚。

SOP的包装比浸入较小,具有矩形形状。

QFP是一个包装,带有平行于包装圆周的销钉,BGA是一个包装,其中在元素的底部钻了小孔,并将小珠连接到它们以连接元素。

根据每个软件包的特征,它用于各种目的。

例如,降低通常用于低密度积分电路,而BGA用于高密度集成电路。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。


链接网址 :

隐私政策
ALLDATASHEETCN.COM
ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com