BUILT-IN Datasheet(PDF) - SDA9206 - Siemens Semiconductor Group

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BUILT-IN 数据表, PDF

: P-tec Corporation(97)Pan Jit International Inc.(48)Panasonic Battery Group(18)Panasonic Semiconductor(120)PANDUIT CORP.(15)Pasternack Enterprises, Inc.(93)PCA ELECTRONICS INC.(11)Pentair plc. All rights reserved.(8)Pepperl+Fuchs Inc.(1)Peregrine Semiconductor(1)Pericom Semiconductor Corporation(3)PETERMANN-TECHNIK(9)PhaseLink Corporation(1)PHOENIX CONTACT(989)Picker Components(38)Pomona Electronics(12)Power IC Ltd.(1)Power Integrations, Inc.(4)Power System Technology(2)Power-One(5)PowerDynamics, Inc(48)Powerex Power Semiconductors(51)Powersem GmbH(3)Powertip Technology(3)Precid-Dip Durtal SA(26)PREMA Semiconductor.(2)PREMIER DEVICES, INC.(42)Premier Magnetics, Inc.(1)Princeton Technology Corp(7)Productwell Precision Elect.CO.,LTD(4)Projects Unlimited, Inc.(17)Prosoft-Technology(1)Protech Systems Co., Ltd.(8)Protek Devices(4)PUI audio inc.(396)PULS GmbH(1)Pulse A Technitrol Company(38)Qimonda AG(3)Qorvo, Inc(4)Qualtek Electronics Corporation(18)Quantum Research Group(1)Quectel Wireless Solutions Co., Ltd.(1)Quelighting Corp(15)Ralston Instruments.(22)Raltron Electronics Corporation(6)Realtek Semiconductor Corp.(1)REAN(1)Recom International Power(11)Rectron Semiconductor(9)Relpol S.A.(1)RENCO ELECTRONICS, INC.(6)Renesas Technology Corp(277)RF Micro Devices(2)RF Monolithics, Inc(2)RFE international(9)RFHIC(8)Rhombus Industries Inc.(2)Richco, Inc.(4)Richtek Technology Corporation(9)RICOH electronics devices division(2)Rochester Electronics(8)Rohm(907)Roithner LaserTechnik GmbH(22)Rosenberger Hochfrequenztechnik GmbH & Co. KG(71)RRC power solutions Ltd.(1)RUBYCON CORPORATION(79)Sames(2)SamHop Microelectronics Corp.(1)Samsung semiconductor(59)Samtec, Inc(3)SAMWHA ELECTRIC(1)Sangdest Microelectronic (Nanjing) Co., Ltd(28)Sanken electric(104)SanRex Corporation(3)Sanyo Semicon Device(102)Schneider Electric(1507)Schurter Inc.(204)Sciosense B.V.(1)SeCoS Halbleitertechnologie GmbH(50)Seiko Instruments Inc(37)Seme LAB(1265)SemiHow Co.,Ltd.(8)Semikron International(1)Semtech Corporation(13)Sensirion AG Switzerland(2)Sensitron(5)Sensortechnics GmbH(5)Seoul Semiconductor(33)SG Micro Corp(7)Shanghai awinic technology co.,ltd(4)SHANGHAI BELLING CO., LTD.(15)Shanghai Cyanlite Technology Co., Ltd.(1)Shanghai Leiditech Electronic Technology Co., Ltd(71)Sharp Corporation(52)SHENZHEN FUMAN ELECTRONICS CO., LTD.(27)Shenzhen Guan Hua Wei Ye Co., Ltd(3)Shenzhen Huazhimei Semiconductor Co., Ltd(64)Shenzhen Jingdao Electronic Co.,Ltd(1)Shenzhen Luguang Electronic Technology Co., Ltd(1)Shenzhenshi YONGFUKANG Technology co.,LTD(6)SHIELD s.r.l.(12)SHIKUES Electronics(7)Shindengen Electric Mfg.Co.Ltd(43)SHINMEI ELECTRIC CO., LTD.(8)SHOUDING Shouding Semiconductor(2)Shoulder Electronics Limited.(3)Siemens Semiconductor Group(133)SIFIRST TECHNOLOGIES NANHAI LIMITED(11)Silan Microelectronics Joint-stock(8)Silicom Ltd.(1)Silicon Laboratories(25)Silicon Storage Technology, Inc(1)Silicon Supplies(20)Silicon Touch Technology Inc.(4)Sipex Corporation(11)Sirectifier Global Corp.(1)SIRENZA MICRODEVICES(5)SiTime Corp.(1)Sitronix Technology Co., Ltd.(1)Skeleton Technologies. All rights reserved.(2)Skyworks Solutions Inc.(22)SL Power Electronics(11)SMSC Corporation(8)Solid State Optronic(25)SONiX Technology Company(1)Sony Corporation(36)Soshin electric Co., Ltd.(1)Source Photonics, Inc.(7)SPANSION(4)SparkFun Electronics(2)Spectrum Microwave, Inc.(2)Stanford Microdevices(1)STANLEY ELECTRIC CO.,LTD.(9)STATEK CORPORATION(2)STATS ChipPAC, Ltd.(1)STMicroelectronics(1092)Sumida Corporation(30)Summit Microelectronics, Inc.(3)SunLED Corporation(4)SUNNY Computer Technology Europe, s.r.o.(9)Suntan Capacitors(6)Supertex, Inc(1)Surge Components(10)SUYIN USA, INC.(7)Suzhou HangJing Electronic Technology Co., LTD(56)Suzhou Maswell Communication Technology Co. Ltd(5)Switchcraft, Inc.(4)Synaptics Incorporated.(2)SYNC POWER Crop.(2)SyncMOS Technologies,Inc(3)SynQor Worldwide Headquarters(3)Systemsensor advanced ideas.(18)TAI-SAW TECHNOLOGY CO., LTD.(3)TAI-TECH Advanced Electronics Co., Ltd.(1)TAITRON Components Incorporated(2)Taiwan Semiconductor Company, Ltd(5)TAMURA Corporation.(1)Taoglas antenna solutions(16)TDK Electronics(1168)TE Connectivity Ltd(93)TelCom Semiconductor, Inc(1)Teledyne Technologies Incorporated(4)Telit loT Solutions(1)TEMEX(7)TEMIC Semiconductors(7)Texas Instruments(545)Texas Instruments(468)Thinki Semiconductor Co., Ltd.(8)THOR communications(3)Tiger Electronic Co.,Ltd(12)TiMOTION Technology Co. Ltd.(3)TOKO, Inc(1)TOKYO SEIMITSU CO., LTD(8)Torex Semiconductor(72)Toshiba Semiconductor(141)Total Power International(9)Touchstone Semiconductor Inc(2)Transcend Information. Inc.(1)Transphorm Inc(33)Transys Electronics(4)TRINAMIC Motion Control GmbH & Co. KG.(2)Tripp Lite. All Rights Reserved(482)TriQuint Semiconductor(4)TT Electronics.(33)TXC Corporation.(12)Tyco Electronics(191)
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搜索关键字 : 'BUILT-IN' - 的资料共: 133 (1/7) Pages

制造商	部件名	数据表	功能描述
Siemens Semiconductor G...	SDA9206	256Kb/54P	ADC with Built in Antialiasing filter and Clock generation UnitS
	PD1165	412Kb/8P	1.16 SQUARE 8X8 DOT MATRIX PROGRAMMABLE DISPLAY MODULE WITH ON BOARD DRIVERS, BUILT-IN RAM AND SOFTWARE CONTROLLABLE FEATURES
	MPD2545	438Kb/10P	25 4-character, 5x7 dot matrix, X-Y stackable, HI-REL/Military Alphanumeric Programmable Display with Built-In CMOS Control Functions
	SDA9088	487Kb/28P	Picture-in-Picture Processor
	STL39002Z	58Kb/3P	IRED in TO-Package
	SFH420	48Kb/5P	GaAs-IR-Lumineszenzdiode in SMT-Gehause GaAs Infrared Emitter in SMT Package
	SFH421	53Kb/5P	GaAlAs-IR-Lumineszenzdiode in SMT-Gehause GaAlAs Infrared Emitter in SMT Package
	SDA9388X	74Kb/2P	Single-Chip Picture in Picture IC
	SRD00111Z	119Kb/5P	Silicon PIN Photodiode in TO-Package
	STH51002Z	43Kb/3P	1300nm Laser in Coaxial TO-Package
	SDA9086-3	174Kb/9P	Horizontal PLL for Picture-in-Picture
	STH81002Z	43Kb/3P	1550nm Laser in Coaxial TO-Package
	KOM2125	241Kb/4P	NEU: 2fach-Silizium-PIN-Fotodiode in SMT NEW: 2-Chip Silicon PIN Photodiode in SMT
	STL51007X	80Kb/4P	1300 nm Laser in Receptacle Package, Low Power
	SDA9188-3X	462Kb/31P	Picture-in-Picture Processor with On-Chip PLL
	STL81007X	550Kb/4P	1550 nm Laser in Receptacle Package, Low Power
	STM51004X	128Kb/4P	1300 nm Laser in Receptacle Package, Medium Power
	SRD00231Z	66Kb/3P	Ternary PIN Photodiode in TO-Package, Central Pin
	BAV99S	42Kb/4P	Silicon Switching Diode Array (For high-speed switching applications Connected in series Internal galvanic isolated Diodes in one package)
	KT100	34Kb/2P	Silicon Spreading Resistance Temperature Sensor in Leaded Plastic Package

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什么是 BUILT-IN

在电子组件中，内置通常意味着嵌入在设备或设备中。

例如，在智能手机的情况下，有各种内置组件，例如相机，传感器，扬声器和麦克风。

内置组件根据设备的大小和功能以各种方式配置。

在大多数设备中，内置组件是预先设计的，并用于改善设备的整体功能和性能。

由于内置组件无需连接到其他零件，因此由于零件之间的连接而导致的错误或信号衰减可以减少。

此外，内置组件在仪器外部受到保护，从而提高了耐用性和可靠性。

内置组件还可以提高便利性和效率。

例如，在智能手机的情况下，您可以使用内置摄像头拍照，并且可以使用内置传感器来检测设备的方向。

这些内置组件允许方便使用各种功能。

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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