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HOLE 数据表, PDF

搜索关键字 : 'HOLE' - 的资料共: 404 (1/21) Pages
制造商部件名数据表功能描述
Company Logo Img
Molex Electronics Ltd.
0877730005 Datasheet pdf image
153Kb/4P
3-Pin Header, Staggered, Vertical, Through Hole, Lead-free
0878313028 Datasheet pdf image
201Kb/3P
2.00mm (.079") Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 30 Circuits, 0.38關m
0879510001 Datasheet pdf image
87Kb/3P
2.50mm (.098) Pitch Header, Vertical, Through Hole, 8 Circuits, Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0878082003 Datasheet pdf image
193Kb/4P
5.08mm (.200) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus??S-P(B) Receptacle, Through Hole, Right Angle
0879571005 Datasheet pdf image
102Kb/3P
2.50mm (.098) Pitch Header, Right Angle, Through Hole, 5 Circuits, Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879571010 Datasheet pdf image
102Kb/3P
2.50mm (.098) Pitch Header, Right Angle, Through Hole, 10 Circuits, Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879571004 Datasheet pdf image
102Kb/3P
2.50mm (.098) Pitch Header, Right Angle, Through Hole, 4 Circuits, Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0878315220 Datasheet pdf image
236Kb/4P
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, 20 Circuits, 0.38關m (15關) Gold (Au) Plating
0878912817 Datasheet pdf image
299Kb/5P
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50關m (100關 Tape on Reel Packaging, Lead-free
0879170052 Datasheet pdf image
615Kb/8P
1.00mm (.039) Pitch Fully Buffered DIMM Socket, 28.5째 Angle, Through Hole, 240 Circuits, with Beveled Metal Pins, with Off-White Latches
0878083001 Datasheet pdf image
204Kb/4P
5.08mm (.200) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus??S-P(B) Receptacle, Through Hole, Right Angle, Beveled Metal Pins
0878743001 Datasheet pdf image
268Kb/5P
5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus??Pa-S Header, Through Hole, Right Angle, Screw Mount
0878743002 Datasheet pdf image
268Kb/5P
5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus??Pa-S Header, Through Hole, Right Angle, Screw Mount
0878251001 Datasheet pdf image
295Kb/6P
1.27mm (.050) Pitch DDR DIMM Socket, 25 Degree Angle, Through Hole, 2.5V Right Voltage Keys, 2.79mm(.110) Tail Length, 100 Circuits
0879700001 Datasheet pdf image
287Kb/6P
1.27mm (.050) Signal Pitch, 0.80mm (.031) SCSI Pitch, 1.27mm (.050) Power Pitch SAS Receptacle, Vertical, Through Hole, with Straight Solder Tab
0878251011 Datasheet pdf image
295Kb/6P
1.27mm (.050) Pitch DDR DIMM Socket, 25 Degree Angle, Through Hole, 2.5V Right Voltage Keys, 3.18mm(.125) Tail Length, 100 Circuits
0879170012 Datasheet pdf image
615Kb/8P
1.00mm (.039) Pitch Fully Buffered DIMM Socket, 28.5째 Angle, Through Hole, 240 Circuits, with Beveled Metal Pins, with Off-White Latches
0878072006 Datasheet pdf image
306Kb/5P
5.08mm (.200) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus??SP (B) Header, Through Hole, Right Angle, Screw Mount, 30 Circuits
0878072007 Datasheet pdf image
306Kb/5P
5.08mm (.200) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus??SP(B) Header, Through Hole, Right Angle, Screw Mount, 30 Circuits
0879170011 Datasheet pdf image
615Kb/8P
1.00mm (.039) Pitch Fully Buffered DIMM Socket, 28.5째 Angle, Through Hole, 240 Circuits, with Beveled Metal Pins, with Off-White Latches

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什么是 HOLE


“孔”是半导体理论中使用的概念之一。

半导体是研究电子操作的领域,可以通过“孔”的概念来解释电子的流动,这是与电子运动和缺乏电子有关的概念。

“孔”是指电子剥夺,这是由于电子从其键合的原子移动而引起的。

这表明粘合原子中缺乏电子。

这些“孔”具有正电荷,而不是电子,并影响电行为。

“孔”在半导体设备设计中起着重要作用。

特别是,在P型半导体装置中,“孔”的运动和电子的运动一起出现。

这些“孔”有助于促进P型半导体设备中电流的运动。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。


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