PACKAGE Datasheet(PDF) - IXYN100N65B3D1 - IXYS Corporation

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PACKAGE 数据表, PDF

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搜索关键字 : 'PACKAGE' - 的资料共: 38 (1/2) Pages

制造商	部件名	数据表	功能描述
IXYS Corporation	IXYN100N65B3D1	229Kb/7P	International Standard Package
	IXYH75N65C3	232Kb/6P	International Standard Package
	IXYH75N65C3D1	243Kb/7P	International Standard Package
	IXYN120N65B3D1	222Kb/7P	International Standard Package
	IXYN120N65C3D1	226Kb/7P	International Standard Package
	IXYH75N65C3H1	237Kb/7P	International Standard Package
	IXYN150N60B3	215Kb/6P	International Standard Package
	IXYN100N65C3H1	231Kb/7P	International Standard Package
	IXYN75N65C3D1	228Kb/7P	International Standard Package
	IXEN60N120	97Kb/4P	NPT3 IGBT in miniBLOC package
	IXKR40N60	46Kb/2P	CoolMOS Power MOSFET in ISOPLUS247 Package
	IXKC20N60C	520Kb/2P	CoolMOS Power MOSFET in ISOPLUS220 Package
	IXDR30N120	69Kb/4P	High Voltage IGBT with optional Diode ISOPLUSTM package
	IXKR25N80C	116Kb/2P	Advanced Technical Information CoolMOS Power MOSFETin ISOPLUS247 Package
	IXSK40N60BD1	50Kb/2P	IGBT with Diode PLUS247TM package Short Circuit SOA Capability
	IXGR32N60C	544Kb/4P	HiPerFASTTM IGBT Lightspeed Series ISOPLUS247TM package(Electrically Isolated Back Side)
	VUO52-08NO1	154Kb/5P	Standard Rectifier Module 3~ Rectifier Bridge Package with DCB ceramic
	GMM3X160-0055X2	197Kb/4P	Three phase full Bridge with Trench MOSFETs in DCB isolated high current package
	GMM3X120-0075X2	195Kb/4P	Three phase full Bridge with Trench MOSFETs in DCB isolated high current package
	GWM160-0055X1	325Kb/6P	Three phase full Bridge with Trench MOSFETs in DCB isolated high current package

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什么是 PACKAGE

在电子零件中，包装是指用于保护和连接设备的外壳或包装。

软件包在保护和连接设备中起着重要作用。

如果设备没有适当保护，则环境影响会损坏或破坏设备。

软件包有各种形状和尺寸，并且根据设备的类型和目的有各种类型。

代表性软件包包括DIP（双线内软件包），SOP（小型外线包），QFP（QUAD FLAT软件包）和BGA（Ball Grid Array）。

DIP是更具代表性的包装之一，并在线放置了两个引脚。

SOP的包装比浸入较小，具有矩形形状。

QFP是一个包装，带有平行于包装圆周的销钉，BGA是一个包装，其中在元素的底部钻了小孔，并将小珠连接到它们以连接元素。

根据每个软件包的特征，它用于各种目的。

例如，降低通常用于低密度积分电路，而BGA用于高密度集成电路。

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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