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PACKAGE 数据表, PDF

P-tec Corporation(550)Pan Jit International Inc.(8)Panasonic Battery Group(8)Panasonic Semiconductor(27)PANDUIT CORP.(1)Pasternack Enterprises, Inc.(74)PCA ELECTRONICS INC.(8)Peregrine Semiconductor(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(13)PETERMANN-TECHNIK(14)PhaseLink Corporation(1)PHOENIX CONTACT(10)Pletronics, Inc.(1)Polyfet RF Devices(1)Power-One(8)Premier Magnetics, Inc.(9)Protek Devices(9)Pulse A Technitrol Company(5)Purdy Electronics Corporation(25)Qorvo, Inc(2)QT Optoelectronics(1)Quantum Research Group(1)QUARTZCOM the communications company(14)Quectel Wireless Solutions Co., Ltd.(2)Quelighting Corp(8)Raltron Electronics Corporation(6)RCD COMPONENTS INC.(1)Recom International Power(25)Rectron Semiconductor(11)Renesas Technology Corp(20)RF Micro Devices(2)RF Monolithics, Inc(26)RFHIC(9)Rhombus Industries Inc.(20)Richtek Technology Corporation(15)RICOH electronics devices division(3)Rochester Electronics(4)Rohm(65)Roithner LaserTechnik GmbH(28)RSG Electronic Components GmbH(7)Sames(1)Samsung semiconductor(5)Sangdest Microelectronic (Nanjing) Co., Ltd(7)Sanken electric(9)SanRex Corporation(6)Sanyo Semicon Device(9)SCHOTT CORPORATION(5)Seiko Instruments Inc(26)Seme LAB(528)Semtech Corporation(2)SEMTECH ELECTRONICS LTD.(1)Sensitron(3)Sensortechnics GmbH(3)Seoul Semiconductor(44)SGX Sensortech(2)Shanghai awinic technology co.,ltd(3)SHANGHAI BELLING CO., LTD.(1)Shanghai Leiditech Electronic Technology Co., Ltd(35)Shanghai Semitech Semiconductor Co., Ltd(12)Shanghai Shunye Electronics Co.,Ltd.(1)SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD(28)Sharp Corporation(104)SHENZHEN FUMAN ELECTRONICS CO., LTD.(1)Shenzhen Huazhimei Semiconductor Co., Ltd(4)Shenzhen Luguang Electronic Technology Co., Ltd(8)SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.(3)SHENZHEN YONGERJIA INDUSTRY CO.,LTD(1)SHIKUES Electronics(14)Shindengen Electric Mfg.Co.Ltd(41)Shoulder Electronics Limited.(2)Siemens Semiconductor Group(49)Silan Microelectronics Joint-stock(4)Silicon Laboratories(3)Silonex Inc.(8)Sirectifier Global Corp.(1)SIRENZA MICRODEVICES(4)Skyworks Solutions Inc.(16)SMSC Corporation(8)Solid State Optronic(53)Solid States Devices, Inc(12)Solitron Devices Inc.(1)SPANSION(19)Stanford Microdevices(1)STANLEY ELECTRIC CO.,LTD.(14)Stanson Technology(8)StarHope(1)STATEK CORPORATION(1)STATS ChipPAC, Ltd.(1)STMicroelectronics(664)SunLED Corporation(295)Surge Components(3)Suzhou HangJing Electronic Technology Co., LTD(47)SynQor Worldwide Headquarters(3)TAI-SAW TECHNOLOGY CO., LTD.(2)TAITRON Components Incorporated(8)Taiwan Semiconductor Company, Ltd(4)Tak Cheong Electronics (Holdings) Co.,Ltd(47)TE Connectivity Ltd(5)Teccor Electronics(1)TelCom Semiconductor, Inc(1)Teledyne Technologies Incorporated(4)TEMEX(4)TEMIC Semiconductors(3)Texas Instruments(276)Texas Instruments(304)THine Electronics, Inc.(5)Thinki Semiconductor Co., Ltd.(35)Torex Semiconductor(7)Toshiba Semiconductor(21)Total Power International(37)Transcom, Inc.(2)Transko Electronics, Inc.(10)TRANSYS Electronics Limited(1)TriQuint Semiconductor(12)TT Electronics.(34)TXC Corporation.(10)Tyco Electronics(19)
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搜索关键字 : 'PACKAGE' - 的资料共: 295 (1/15) Pages
制造商部件名数据表功能描述
Company Logo Img
SunLED Corporation
XZFMDK07C Datasheet pdf image
266Kb/4P
Robust package
XDVG14C2 Datasheet pdf image
227Kb/3P
Robust package
XZFBBA05C Datasheet pdf image
291Kb/4P
Robust package
XZFMDK14A Datasheet pdf image
250Kb/4P
Robust package
XZMYKVG55W-4 Datasheet pdf image
264Kb/4P
Long life and robust package
XZMDKVG45WT Datasheet pdf image
273Kb/4P
Long life and robust package
XZBGR68W5MAV-3 Datasheet pdf image
235Kb/4P
Long life and robust package
XZCBD67S Datasheet pdf image
280Kb/5P
Long life and robust package
XZDGK50W-2 Datasheet pdf image
285Kb/4P
Long life and robust package
XZDGK55W-1 Datasheet pdf image
244Kb/4P
Long life and robust package
XZDGK55W-2 Datasheet pdf image
279Kb/4P
Long life and robust package
XZFBB67S Datasheet pdf image
278Kb/5P
Long life and robust package
XZFBB74W Datasheet pdf image
267Kb/4P
Long life and robust package
XZM2MR55W-3 Datasheet pdf image
254Kb/4P
Long life and robust package
XZM2MRTNI59W-1 Datasheet pdf image
289Kb/4P
Long life and robust package
XZMDK87W Datasheet pdf image
259Kb/4P
Long life and robust package
XZMOK55W-2 Datasheet pdf image
245Kb/4P
Long life and robust package
XZMOK87W Datasheet pdf image
259Kb/4P
Long life and robust package
XZMDKDGK54W-4 Datasheet pdf image
293Kb/4P
Long life and robust package
XZVG74W Datasheet pdf image
235Kb/4P
Long life and robust package

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什么是 PACKAGE


在电子零件中,包装是指用于保护和连接设备的外壳或包装。

软件包在保护和连接设备中起着重要作用。

如果设备没有适当保护,则环境影响会损坏或破坏设备。

软件包有各种形状和尺寸,并且根据设备的类型和目的有各种类型。

代表性软件包包括DIP(双线内软件包),SOP(小型外线包),QFP(QUAD FLAT软件包)和BGA(Ball Grid Array)。

DIP是更具代表性的包装之一,并在线放置了两个引脚。

SOP的包装比浸入较小,具有矩形形状。

QFP是一个包装,带有平行于包装圆周的销钉,BGA是一个包装,其中在元素的底部钻了小孔,并将小珠连接到它们以连接元素。

根据每个软件包的特征,它用于各种目的。

例如,降低通常用于低密度积分电路,而BGA用于高密度集成电路。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。


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