PACKAGE Datasheet(PDF) - AFBR-57E6APZ-HT - Broadcom Corporation.

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PACKAGE 数据表, PDF

: ALL A-BRIGHT Inc(45)ABLIC Inc.(10)Abracon Corporation(23)ACCUTEK MICROCIRCUIT CORPORATION(8)ACE Technology Co., LTD.(1)Actel Corporation(3)Acutechnology Semiconductor(10)Advanced Analog Technology, Inc.(2)Advanced Analogic Technologies(8)Advanced Crystal Technology(10)Advanced Micro Devices(14)Advanced Photonix, Inc.(24)Advanced Power Electronics Corp.(112)Advanced Power Technology(2)Advanced Semiconductor(4)Advanced Technical Materials Inc.(1)Advanced Thermal Solutions, Inc.(14)Advanced XTAL Products(87)Advantech Co., Ltd.(5)Aeroflex Circuit Technology(3)Agilent(Hewlett-Packard)(34)AIMTEC(1)AiT Semiconductor Inc.(3)All Sensors Corporation(6)Allegro MicroSystems(19)Allen-Bradley(1)Alliance Semiconductor Corporation(17)Allied Components International(3)Alpha & Omega Semiconductors(89)ALPS ELECTRIC CO.,LTD.(2)Altera Corporation(5)AMAZING Microelectronic Corp.(37)American Accurate Components, Inc.(5)American Microsemiconductor(52)AMIC Technology(4)Amkor Technology(21)Amphenol Corporation(4)Analog Devices(82)Analog Intergrations Corporation(1)Analog Microelectronics(1)Anaren Microwave(5)Anpec Electronics Coropration(2)Anshan Suly Electronics(1)API Delevan(3)Aries Electronics, Inc.(4)Asahi Kasei Microsystems(35)Astec America, Inc(2)ATMEL Corporation(3)AVAGO TECHNOLOGIES LIMITED(127)AVG Semiconductors(HITEK)(1)Avic Technology(1)AVX Corporation(1)BCM Advanced Research.(1)Bel Fuse Inc.(17)BetLux Electronics(15)Bi technologies(3)Bivar, Inc.(193)Bolymin, Inc(73)Bothhand USA, LP.(6)Bourns Electronic Solutions(9)BRIGHT LED ELECTRONICS CORP(41)Broadcom Corporation.(76)Bruckewell Technology LTD(2)Bud Industries, Inc.(1)C&D Technologies(1)C&K Components(3)California Eastern Labs(72)California Micro Devices Corp(9)CAMBION Electronic Components(4)Catalyst Semiconductor(3)Central Semiconductor Corp(39)Chicago Miniature Lamp,inc(9)CITIZEN ELECTRONICS CO., LTD.(98)Clairex Technologies, Inc(11)CML Microcircuits(3)Compensated Deuices Incorporated(4)Connor-Winfield Corporation(1)Continental Device India Limited(56)COSMO Electronics Corporation(23)Cree, Inc(1)Crydom Inc.,(5)Crystek Corporation(1)CTS Corporation(5)CUI INC(3)Cypress Semiconductor(4)Cystech Electonics Corp.(3)DAICO Industries, Inc.(1)Dallas Semiconductor(4)Datatronic Distribution, Inc.(3)DB Lectro Inc(14)Delta Electronics, Inc.(65)Dialight Corporation(13)Dialog Semiconductor(2)DinTek Semiconductor Co,.Ltd(1)Diodes Incorporated(37)DIYI Electronic Technology Co., Ltd.(2)E&E Magnetic Products Limited(3)E-SWITCH(45)E-Tech Electronics LTD(3)Ecliptek Corporation(1)ECS, Inc.(4)EHAOAN.(40)Elantec Semiconductor(1)Elite Enterprises (H.K.) Co., Ltd.(1)ELM Electronics(2)ELM Technology Corporation(34)Emerson Network Power(4)Enpirion, Inc.(1)Eon Silicon Solution Inc.(3)EPCOS(2)Epson Company(2)ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD.(1)ETA SOLUTIONS CO. LIMITED(6)EUROQUARTZ limited(9)Eutech Microelectronics Inc(6)Everlight Electronics Co., Ltd(389)Exar Corporation(2)
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搜索关键字 : 'PACKAGE' - 的资料共: 76 (1/4) Pages

制造商	部件名	数据表	功能描述
Broadcom Corporation.	AFBR-57E6APZ-HT	681Kb/18P	Industry standard Small Form Pluggable (SFP) package
	DEMO-VMMK3413-35	650Kb/8P	25 - 45 GHz Directional Detector in SMT Package
	DEMO-VMMK3313-24	645Kb/8P	15 - 33 GHz Directional Detector in SMT Package
	DEMO-VMMK-3213	683Kb/9P	6 - 18 GHz Directional Detector in SMT Package
	DEMO-VMMK-3113	686Kb/8P	2 - 6 GHz Directional Detector in SMT Package
	DEMO-VMMK3413-42	650Kb/8P	25 - 45 GHz Directional Detector in SMT Package
	ACNT-H50L	644Kb/11P	1-MBd Optocoupler in 15-mm Stretched SO8 Package
	VMMK-3503	1Mb/12P	0.5 - 18 GHz Variable Gain Amplifier in SMT Package
	AMMP-5620	201Kb/7P	6 ??20 GHz High Gain Amplifier in SMT Package
	AMMP-6430	271Kb/9P	27-34 GHz, 0.5W Power Amplifier in SMT Package
	AFBR-5302Z	98Kb/10P	Fibre Channel 266 MBd Transceiver in 1x9 Package Style
	DEMO-ATF-5X189	430Kb/22P	Enhancement Mode[1] Pseudomorphic HEMT in SOT 89 Package
	ATF-331M4	384Kb/15P	Low Noise Pseudomorphic HEMT in a Miniature Leadless Package
	AMMP-6425	277Kb/9P	18-28 GHz 1W Power Amplifier in SMT Package
	AMMP-6441	263Kb/9P	36 - 40 GHz, 0.4W Power Amplifi er in SMT Package
	AMGP-6552	151Kb/8P	37 ??43.5 GHz Low Noise Down-Converter in SMT Package
	AMMP-6421	311Kb/10P	13-16 GHz 1W Power Amplifi er in SMT Package
	AFBR-5903Z	423Kb/16P	FDDI, Fast Ethernet Transceivers in 2 x 5 Package Style
	VMMK-3803	1,023Kb/11P	3 - 11 GHz UWB Low Noise Amplifier in SMT Package
	ATF-35143	521Kb/18P	Low Noise Pseudomorphic HEMT in a Surface Mount Plastic Package

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什么是 PACKAGE

在电子零件中，包装是指用于保护和连接设备的外壳或包装。

软件包在保护和连接设备中起着重要作用。

如果设备没有适当保护，则环境影响会损坏或破坏设备。

软件包有各种形状和尺寸，并且根据设备的类型和目的有各种类型。

代表性软件包包括DIP（双线内软件包），SOP（小型外线包），QFP（QUAD FLAT软件包）和BGA（Ball Grid Array）。

DIP是更具代表性的包装之一，并在线放置了两个引脚。

SOP的包装比浸入较小，具有矩形形状。

QFP是一个包装，带有平行于包装圆周的销钉，BGA是一个包装，其中在元素的底部钻了小孔，并将小珠连接到它们以连接元素。

根据每个软件包的特征，它用于各种目的。

例如，降低通常用于低密度积分电路，而BGA用于高密度集成电路。

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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