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PACKAGE 数据表, PDF

Fairchild Semiconductor(57)FCI connector(1)Finisar Corporation.(18)First Components International(4)First Silicon Co., Ltd(6)Fitipower Integrated Technology Inc.(2)Formosa MS(2)Foshan Blue Rocket Electronics Co.,Ltd.(1728)Fox Electronics(2)Freescale Semiconductor, Inc(6)Fuji Electric(132)Fujikura Ltd.(4)Fujitsu Component Limited.(11)Future Technology Devices International Ltd.(1)FutureWafer Tech Co.,Ltd(12)Galaxy Semi-Conductor Holdings Limited(22)Gamma Microelectronics Inc.(2)Gaomi Xinghe Electronics Co., Ltd.(1)GAPTEC Electronic GmbH & Co. KG(28)GeneSiC Semiconductor, Inc.(15)Gilway Technical Lamp(1)Global Mixed-mode Technology Inc(157)Golledge Electronics Ltd(43)Grayhill, Inc(4)Green Power Solutions srl(4)GSI Technology(306)GuangDong Province MengCo Semiconductor Co., Ltd(2)Guangdong Youtai Semiconductor Co., Ltd.(24)Guangzhou Reicu Electronic Technology Co., Ltd(38)HALO Electronics, Inc.(12)Hamamatsu Corporation(43)HB Electronic Components(2)Hi-Sincerity Mocroelectronics(2)Hitachi Semiconductor(1)HITRON ELECTRONICS CORPORTION(12)HK TO-GRACE TECHNOLOGY CO.,LTD.(212)Holt Integrated Circuits(1)Holtek Semiconductor Inc(10)Honeywell Accelerometers(15)Honeywell Solid State Electronics Center(6)HuaXinAn Electronics CO.,LTD(2)HY ELECTRONIC CORP.(2)IDEA.lnc.(10)IK Semicon Co., Ltd(2)ILSI America LLC(81)Inchange Semiconductor Company Limited(40)Infineon Technologies AG(74)Integrated Circuit Solution Inc(1)Integrated Circuit Systems(1)Integrated Device Technology(8)Integrated Silicon Solution, Inc(3)Integrated Technology Future(1)Intel Corporation(5)InterFET Corporation(1)International Rectifier(161)Intersil Corporation(3)Intronics Power, Inc.(1)IQD Frequency Products Ltd(11)IRC - a TT electronics Company.(1)Ironwood Electronics.(2)Isahaya Electronics Corporation(2)ITT Industries(1)IXYS Corporation(38)Japan Aviation Electronics Industry, Ltd.(1)JDS Uniphase Corporation(2)JMK Inc.(2)
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搜索关键字 : 'PACKAGE' - 的资料共: 43 (1/3) Pages
制造商部件名数据表功能描述
Company Logo Img
Golledge Electronics Lt...
GWX-1610 Datasheet pdf image
565Kb/4P
1610 Package 32.768kHz Watch Crystal
GXO-7506G Datasheet pdf image
594Kb/5P
7550 Package Ultra-Low Jitter 1.8V Oscillator
GSX-7A Datasheet pdf image
552Kb/4P
Two Pad SM Crystal with Ceramic Package
GXO-7506L Datasheet pdf image
595Kb/5P
7550 Package Ultra-Low Jitter 3.3V Oscillator
GSX-1C Datasheet pdf image
558Kb/4P
Two Pad SM Crystal with Ceramic Package
GSX-1A Datasheet pdf image
556Kb/4P
Two Pad SM Crystal with Ceramic Package
GXO-3232J Datasheet pdf image
585Kb/5P
2.5V Tight Stability Oscillator with 2520 Package
GXO-3232L Datasheet pdf image
585Kb/5P
3.3V Tight Stability Oscillator with 2520 Package
GXO-3306L Datasheet pdf image
594Kb/5P
3225 Package Ultra-Low Jitter 3.3V Oscillator
GVXO-44F Datasheet pdf image
550Kb/4P
3.3V VCXO - High Frequency, DIL-14 Package
GVXO-523 Datasheet pdf image
596Kb/5P
3.3V SM VCXO - 5.0x3.2mm 4-pad package
GAO-3301 Datasheet pdf image
592Kb/5P
1.8~3.3V 32.768kHz Oscillator with 3225 Package
GXO-7506J Datasheet pdf image
595Kb/5P
7550 Package Ultra-Low Jitter 2.5V Oscillator
GXO-3306G Datasheet pdf image
594Kb/5P
3225 Package Ultra-Low Jitter 1.8V Oscillator
GSX-1B Datasheet pdf image
557Kb/4P
Four Pad SM Crystal with Ceramic Package
GXO-3306J Datasheet pdf image
594Kb/5P
3225 Package Ultra-Low Jitter 2.5V Oscillator
GVXO-41F Datasheet pdf image
550Kb/4P
5V voltage controlled oscillator - 14 pin DIL package
GVXO-42F Datasheet pdf image
550Kb/4P
5V VCXO - High Frequency - 14-pin DIL package
GSX-8A Datasheet pdf image
552Kb/4P
Two Pad SM Crystal with Miniature Ceramic Package
CM8V-T1A Datasheet pdf image
560Kb/4P
Ultra-Miniature 2012 Package 32.768kHz SM Watch Crystal

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什么是 PACKAGE


在电子零件中,包装是指用于保护和连接设备的外壳或包装。

软件包在保护和连接设备中起着重要作用。

如果设备没有适当保护,则环境影响会损坏或破坏设备。

软件包有各种形状和尺寸,并且根据设备的类型和目的有各种类型。

代表性软件包包括DIP(双线内软件包),SOP(小型外线包),QFP(QUAD FLAT软件包)和BGA(Ball Grid Array)。

DIP是更具代表性的包装之一,并在线放置了两个引脚。

SOP的包装比浸入较小,具有矩形形状。

QFP是一个包装,带有平行于包装圆周的销钉,BGA是一个包装,其中在元素的底部钻了小孔,并将小珠连接到它们以连接元素。

根据每个软件包的特征,它用于各种目的。

例如,降低通常用于低密度积分电路,而BGA用于高密度集成电路。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。


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