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PACKAGE 数据表, PDF

ALL A-BRIGHT Inc(45)ABLIC Inc.(10)Abracon Corporation(23)ACCUTEK MICROCIRCUIT CORPORATION(8)ACE Technology Co., LTD.(1)Actel Corporation(3)Acutechnology Semiconductor(10)Advanced Analog Technology, Inc.(2)Advanced Analogic Technologies(8)Advanced Crystal Technology(10)Advanced Micro Devices(14)Advanced Photonix, Inc.(24)Advanced Power Electronics Corp.(112)Advanced Power Technology(2)Advanced Semiconductor(4)Advanced Technical Materials Inc.(1)Advanced Thermal Solutions, Inc.(14)Advanced XTAL Products(87)Advantech Co., Ltd.(5)Aeroflex Circuit Technology(3)Agilent(Hewlett-Packard)(34)AIMTEC(1)AiT Semiconductor Inc.(3)All Sensors Corporation(6)Allegro MicroSystems(19)Allen-Bradley(1)Alliance Semiconductor Corporation(17)Allied Components International(3)Alpha & Omega Semiconductors(89)ALPS ELECTRIC CO.,LTD.(2)Altera Corporation(5)AMAZING Microelectronic Corp.(37)American Accurate Components, Inc.(5)American Microsemiconductor(52)AMIC Technology(4)Amkor Technology(21)Amphenol Corporation(4)Analog Devices(82)Analog Intergrations Corporation(1)Analog Microelectronics(1)Anaren Microwave(5)Anpec Electronics Coropration(2)Anshan Suly Electronics(1)API Delevan(3)Aries Electronics, Inc.(4)Asahi Kasei Microsystems(35)Astec America, Inc(2)ATMEL Corporation(3)AVAGO TECHNOLOGIES LIMITED(127)AVG Semiconductors(HITEK)(1)Avic Technology(1)AVX Corporation(1)BCM Advanced Research.(1)Bel Fuse Inc.(17)BetLux Electronics(15)Bi technologies(3)Bivar, Inc.(193)Bolymin, Inc(73)Bothhand USA, LP.(6)Bourns Electronic Solutions(9)BRIGHT LED ELECTRONICS CORP(41)Broadcom Corporation.(76)Bruckewell Technology LTD(2)Bud Industries, Inc.(1)C&D Technologies(1)C&K Components(3)California Eastern Labs(72)California Micro Devices Corp(9)CAMBION Electronic Components(4)Catalyst Semiconductor(3)Central Semiconductor Corp(39)Chicago Miniature Lamp,inc(9)CITIZEN ELECTRONICS CO., LTD.(98)Clairex Technologies, Inc(11)CML Microcircuits(3)Compensated Deuices Incorporated(4)Connor-Winfield Corporation(1)Continental Device India Limited(56)COSMO Electronics Corporation(23)Cree, Inc(1)Crydom Inc.,(5)Crystek Corporation(1)CTS Corporation(5)CUI INC(3)Cypress Semiconductor(4)Cystech Electonics Corp.(3)DAICO Industries, Inc.(1)Dallas Semiconductor(4)Datatronic Distribution, Inc.(3)DB Lectro Inc(14)Delta Electronics, Inc.(65)Dialight Corporation(13)Dialog Semiconductor(2)DinTek Semiconductor Co,.Ltd(1)Diodes Incorporated(37)DIYI Electronic Technology Co., Ltd.(2)E&E Magnetic Products Limited(3)E-SWITCH(45)E-Tech Electronics LTD(3)Ecliptek Corporation(1)ECS, Inc.(4)EHAOAN.(40)Elantec Semiconductor(1)Elite Enterprises (H.K.) Co., Ltd.(1)ELM Electronics(2)ELM Technology Corporation(34)Emerson Network Power(4)Enpirion, Inc.(1)Eon Silicon Solution Inc.(3)EPCOS(2)Epson Company(2)ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD.(1)ETA SOLUTIONS CO. LIMITED(6)EUROQUARTZ limited(9)Eutech Microelectronics Inc(6)Everlight Electronics Co., Ltd(389)Exar Corporation(2)
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搜索关键字 : 'PACKAGE' - 的资料共: 21 (1/2) Pages
制造商部件名数据表功能描述
Company Logo Img
Amkor Technology
PSVFBGA Datasheet pdf image
251Kb/2P
Package on Package (PoP) Family
FLATPACK Datasheet pdf image
490Kb/1P
Ceramic Flat Pack Package
LCC Datasheet pdf image
459Kb/1P
Leadless Chip Carrier Package
CDIP Datasheet pdf image
374Kb/1P
Ceramic Dual-Inline Package
PPGA Datasheet pdf image
304Kb/1P
Plastic Pin Grid Array Package
CSSOP Datasheet pdf image
304Kb/1P
Ceramic Shrink Small Outline Package
CMCM Datasheet pdf image
303Kb/1P
Ceramic Multi-Chip Module Package
CPGA Datasheet pdf image
533Kb/1P
Ceramic Pin Grid Array Package
POWERSOP Datasheet pdf image
311Kb/2P
Power Small Outline Package,PowerSOP
CLGA Datasheet pdf image
357Kb/1P
Ceramic Land Grid Array Package
CQFP Datasheet pdf image
332Kb/1P
Ceramic Quad Flat Pack Package
CSOIC Datasheet pdf image
374Kb/1P
Ceramic Small Outline Integrated Circuit Package
MICROLEADFRAME Datasheet pdf image
754Kb/3P
Saw MLF PEL (Plated End Lead) Package
MQFP Datasheet pdf image
389Kb/2P
Amkor?셲 MQFP IC package portfolio provides
PLCC Datasheet pdf image
387Kb/2P
Amkor?셲 PLCC IC package portfolio provides
FCCSP Datasheet pdf image
119Kb/2P
a flip chip solution in a CSP package format.
FUSIONQUAD Datasheet pdf image
394Kb/2P
Increased I/O (116 to 356) in smaller package footprints
PBGA Datasheet pdf image
299Kb/2P
Innovative designs and expanding package offerings provide a platform from prototype-to-production
MCMPBGA Datasheet pdf image
129Kb/2P
Innovative designs and expanding package offerings provide a platform from prototype-to-production
CBGA Datasheet pdf image
504Kb/1P
From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production.

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什么是 PACKAGE


在电子零件中,包装是指用于保护和连接设备的外壳或包装。

软件包在保护和连接设备中起着重要作用。

如果设备没有适当保护,则环境影响会损坏或破坏设备。

软件包有各种形状和尺寸,并且根据设备的类型和目的有各种类型。

代表性软件包包括DIP(双线内软件包),SOP(小型外线包),QFP(QUAD FLAT软件包)和BGA(Ball Grid Array)。

DIP是更具代表性的包装之一,并在线放置了两个引脚。

SOP的包装比浸入较小,具有矩形形状。

QFP是一个包装,带有平行于包装圆周的销钉,BGA是一个包装,其中在元素的底部钻了小孔,并将小珠连接到它们以连接元素。

根据每个软件包的特征,它用于各种目的。

例如,降低通常用于低密度积分电路,而BGA用于高密度集成电路。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。


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