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PACKAGE 数据表, PDF

KEC(Korea Electronics)(406)Kemet Corporation(3)Kersemi Electronic Co., Ltd.(122)Keysight Technologies(1)Kingbor Technology Co(1)Kingston Technology Far East Co. Ltd(1)KOA Speer Electronics, Inc.(2)KODENSHI_AUK CORP.(51)KR Electronics, Inc.(5)Kyocera Kinseki Corpotation(1)Laird Tech Smart Technology(1)Lattice Semiconductor(1)Leshan Radio Company(48)LETEX TECHNOLOGY CORP.(1)LIGITEK electronics co., ltd.(1)Linear Dimensions Semiconductor(1)Linear Integrated Systems(2)Linear Technology(34)Linx Technologies(3)List of Unclassifed Manufacturers(54)List of Unclassifed Manufacturers(96)Lite-On Technology Corporation(46)Littelfuse(22)Lowpower Semiconductor inc(10)LUMEX INC.(8)Lumileds Lighting Company(36)Luminus, Inc(1)Luna Innovations Incorporated(17)LUXPIA(2)M-System Co.,Ltd.(3)M.S. Kennedy Corporation(42)M/A-COM Technology Solutions, Inc.(32)Macronix International(4)Marki Microwave(6)Marktech Corporate(5)Maxim Integrated Products(154)Mean Well Enterprises Co., Ltd.(24)Melexis Microelectronic Systems(2)Mercury United Electronics Inc(6)MIC GROUP RECTIFIERS(1)MICORO CRYSTAL SWITZERLAND(7)Micrel Semiconductor(8)Micro Commercial Components(6)Micro Electronics(9)Microchip Technology(5)Microdc power Technology Co., Ltd(10)Microdiode Electronics (Jiangsu) Co.,Ltd.(2)Micron Technology(1)Micronas(3)Micropac Industries(8)Microsemi Corporation(22)Micross Components(2)Mimix Broadband(3)Minilogic Device Corporation Limited(1)Minmax Technology Co., Ltd.(83)Mitsubishi Electric Semiconductor(389)MMD Components(48)Molex Electronics Ltd.(12)Molex Electronics Ltd.(13)Molex Electronics Ltd.(8)Molex Electronics Ltd.(28)Molex Electronics Ltd.(4)Molex Electronics Ltd.(4)Monolithic Power Systems(41)MORNSUN Science& Technology Ltd.(45)Morse Mfg. Co., Inc.(1)Mosel Vitelic, Corp(4)Mospec Semiconductor(1)Motorola, Inc(32)MPS Industries, Inc.(5)MTRONPTI(3)Murata Manufacturing Co., Ltd(3)Murata Manufacturing Co., Ltd.(8)Murata Power Solutions Inc.(3)MUSIC Semiconductors(1)Nais(Matsushita Electric Works)(4)Nanjing International Group Co(4)Nanjing Ouzhuo Technology Co., Ltd.(2)National Semiconductor (TI)(54)NEC(29)Nel Frequency Controls,inc(9)Nell Semiconductor Co., Ltd(9)New Japan Radio(3)New Jersey Semi-Conductor Products, Inc.(18)Newhaven Display International, Inc.(2)Nexperia B.V. All rights reserved(67)Nihon Inter Electronics Corporation(3)Nippon Precision Circuits Inc(2)Nisshinbo Micro Devices Inc.(2)Numonyx B.V(11)NXP Semiconductors(81)NXP Semiconductors(52)Ohmite Mfg. Co.(14)OKI electronic componets(10)Omron Electronics LLC(27)ON Semiconductor(219)OPTEK Technologies(35)OptoDiode Corp(2)Optoway Technology Inc(23)OSRAM GmbH(1013)
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搜索关键字 : 'PACKAGE' - 的资料共: 36 (1/2) Pages
制造商部件名数据表功能描述
Company Logo Img
Lumileds Lighting Compa...
LHDF-RB10300000000 Datasheet pdf image
1Mb/12P
Chip Scale Package LED
PB179 Datasheet pdf image
1Mb/2P
Unmatched performance in a proven package
DS179 Datasheet pdf image
2Mb/18P
Unmatched performance in a proven package
L1MX-277012V000000 Datasheet pdf image
2Mb/18P
Unmatched performance in a proven package
20200607
L130-2780HB30000B1 Datasheet pdf image
2Mb/22P
Industry leading efficacy, 3V 3030 package
20210120
L1MC-RGB0035000MP0 Datasheet pdf image
1Mb/13P
RGB 3-in-1 versatile package
20190311
DS206 Datasheet pdf image
1Mb/21P
High voltage package that reduces system BOM
PB207 Datasheet pdf image
1Mb/2P
High flux, hot-color targeted 6V package
DS207 Datasheet pdf image
2Mb/21P
High flux, hot-color targeted 6V package
DS116 Datasheet pdf image
1Mb/17P
High current density Chip Scale Package (CSP) LED
PB116 Datasheet pdf image
1Mb/2P
High current density Chip Scale Package (CSP) LED
L130-2780001400001 Datasheet pdf image
1Mb/24P
Hot color targeted industry standard package for uniformed light
MXC8-PW27-0000 Datasheet pdf image
1Mb/25P
High efficacy for sustainable design Compact 3535 2D package
DS208 Datasheet pdf image
3Mb/25P
Hot-color targeted industry standard package for uniform light
DS208-L Datasheet pdf image
4Mb/25P
Hot-color targeted industry standard package for uniform light
PB208 Datasheet pdf image
1Mb/2P
Hot-color targeted industry standard package for uniform light
L130-2780003000W21 Datasheet pdf image
1Mb/23P
Hot color targeted 6V QFN package delivering high flux
L130-8070001400001 Datasheet pdf image
2Mb/22P
High efficacy compact package, designed for high quality light output
20200426
L1MC-RGB2290500MP0 Datasheet pdf image
2Mb/20P
LUXEON MultiColor Module 2.5W RGBW 4-in-1 versatile package
20210428
L135-27800BHV00001 Datasheet pdf image
2Mb/21P
High voltage package that reduces system BOM while achieving high efficacy

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什么是 PACKAGE


在电子零件中,包装是指用于保护和连接设备的外壳或包装。

软件包在保护和连接设备中起着重要作用。

如果设备没有适当保护,则环境影响会损坏或破坏设备。

软件包有各种形状和尺寸,并且根据设备的类型和目的有各种类型。

代表性软件包包括DIP(双线内软件包),SOP(小型外线包),QFP(QUAD FLAT软件包)和BGA(Ball Grid Array)。

DIP是更具代表性的包装之一,并在线放置了两个引脚。

SOP的包装比浸入较小,具有矩形形状。

QFP是一个包装,带有平行于包装圆周的销钉,BGA是一个包装,其中在元素的底部钻了小孔,并将小珠连接到它们以连接元素。

根据每个软件包的特征,它用于各种目的。

例如,降低通常用于低密度积分电路,而BGA用于高密度集成电路。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。


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