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PLATING 数据表, PDF

搜索关键字 : 'PLATING' - 的资料共: 136 (1/7) Pages
制造商部件名数据表功能描述
Company Logo Img
Molex Electronics Ltd.
0357607310 Datasheet pdf image
112Kb/2P
Wire Splice, 10-12 AWG, Post-Tin Plating
0357607210 Datasheet pdf image
119Kb/2P
Wire Splice, 12-16 AWG, Post-Tin Plating
0357607110 Datasheet pdf image
119Kb/2P
Wire Splice, 16-20 AWG, Post-Tin Plating
0357504810 Datasheet pdf image
114Kb/2P
Ring Tongue Terminal for 14-18 AWG (0.75~2.08mm짼), Stud Size 8 M4, Tin Plating
0357501210 Datasheet pdf image
70Kb/2P
Ring Tongue Terminal for 14-18 AWG (0.75~2.08mm짼), Stud Size 8 M4, Tin Plating
0357501710 Datasheet pdf image
89Kb/2P
Ring Tongue Terminal for 9-14 AWG (2.20~6.70mm짼), Stud Size 8 M4, Tin Plating
0357501010 Datasheet pdf image
122Kb/2P
Ring Tongue Terminal for 14-18 AWG (0.75~2.08mm짼), Stud Size 8 M4, Tin Plating
0357501810 Datasheet pdf image
75Kb/2P
Ring Tongue Terminal for 9-14 AWG (2.20~6.70mm짼), Stud Size 10 M5, Tin Plating
0357500910 Datasheet pdf image
111Kb/2P
Ring Tongue Terminal for 14-18 AWG (0.75~2.08mm짼), Stud Size 8 M4, Tin Plating
15-91-3083 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 8 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-3153 Datasheet pdf image
51Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 15 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0357501410 Datasheet pdf image
75Kb/2P
Ring Tongue Terminal for 20-22 AWG (0.30~0.50mm짼), Stud Size 5-6 (M3-3.5), Tin Plating
0417710902 Datasheet pdf image
247Kb/8P
3.96mm (.156") Pitch KK Solid Header, Vertical, without Peg, 5 Circuits, 0.38um (15u") Gold (Au) Selective Plating
0357501910 Datasheet pdf image
76Kb/2P
Ring Tongue Terminal for 10-16 AWG (1.38~5.4mm짼), Stud Size 1/4" (M6), Post-Tin Plating
15-91-3123 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 12 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-3133 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 13 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-3193 Datasheet pdf image
40Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 19 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-3143 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 14 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0357500310 Datasheet pdf image
69Kb/2P
Ring Tongue Terminal for 24-28 AWG (0.08~0.20mm짼), Stud Size 1-2 M1.7-2.2, Tin Plating
15-91-3093 Datasheet pdf image
47Kb/2P
2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 9 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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什么是 PLATING


“电子组件电镀”在电子组件的制造过程中起重要作用。

电镀用于改善电子组件的外观或改善其电子性能。

例如,电镀用于防止腐蚀和提高耐用性。

电镀也用于提高电阻和电导率。

这些平台可以应用于电子组件的连接销,垫子,箱子和其他部分。

电子组件中使用的电镀类型包括金,银,镍和铜。

其中,由于其出色的耐腐蚀性和电性能,黄金镀金是最常用和广泛使用的。

电子零件的电镀类型和应用方法因零件,设备组成和使用环境的目的而异。

因此,在电子组件制造过程中,通过选择适当的电镀方法来确保确保最佳性能和耐用性。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。


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