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PLATING 数据表, PDF

Lite-On Technology Corporation(4)Molex Electronics Ltd.(1360)Molex Electronics Ltd.(836)Molex Electronics Ltd.(6010)Molex Electronics Ltd.(860)Molex Electronics Ltd.(320)Molex Electronics Ltd.(792)Molex Electronics Ltd.(136)Molex Electronics Ltd.(82)Molex Electronics Ltd.(760)Molex Electronics Ltd.(1753)Molex Electronics Ltd.(1877)Molex Electronics Ltd.(2392)Murata Manufacturing Co., Ltd(67)Neutrik AG(8)
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搜索关键字 : 'PLATING' - 的资料共: 860 (1/43) Pages
制造商部件名数据表功能描述
Company Logo Img
Molex Electronics Ltd. 		0740950046 Datasheet pdf image
221Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 16 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating
0740950055 Datasheet pdf image
221Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 25 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating
0740950085 Datasheet pdf image
221Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 25 Circuits0.76關m (30關") Gold (Au) Selective Plating over Tin (Sn) Plating
0740950050 Datasheet pdf image
221Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 20 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating
0740950080 Datasheet pdf image
221Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 20 Circuits,0.76關m (30關") Gold (Au) Selective Plating over Tin (Sn) Plating
0705430113 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 9Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630023 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 24Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430016 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 17Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430127 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 23Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430112 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 8Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630007 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 8Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630012 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 13Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430008 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 9Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430015 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 16Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630003 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 4Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630020 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 21Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630014 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 15Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430110 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 6Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430001 Datasheet pdf image
429Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 2Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705630122 Datasheet pdf image
225Kb/4P		 2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 18Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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什么是 PLATING

“电子组件电镀”在电子组件的制造过程中起重要作用。

电镀用于改善电子组件的外观或改善其电子性能。

例如，电镀用于防止腐蚀和提高耐用性。

电镀也用于提高电阻和电导率。

这些平台可以应用于电子组件的连接销，垫子，箱子和其他部分。

电子组件中使用的电镀类型包括金，银，镍和铜。

其中，由于其出色的耐腐蚀性和电性能，黄金镀金是最常用和广泛使用的。

电子零件的电镀类型和应用方法因零件，设备组成和使用环境的目的而异。

因此，在电子组件制造过程中，通过选择适当的电镀方法来确保确保最佳性能和耐用性。

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。


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