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PLATING 数据表, Datasheet

搜索说明 : 'PLATING' - 的资料共l: 15089 (1/755) 页
制造商部件名浏览功能描述

Molex Electronics Ltd.
15-91-3153 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 15 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0485 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0010897582 2.54mm Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 58 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm PC Tail
0705550039 2.54mm Pitch SL™ Header, Single Row, Right Angle, Pocket, Shrouded,with Press-fit Plastic Peg, 5 Circuits, 0.38μm Gold (Au) Selective Plating, Tin(Sn) PC Tail Plating
0702464004 2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 40Circuits, 0.127μm Gold (Au) Plating, Tin(Sn) PC Tail Plating
15-80-1521 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
15-80-0585 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0403 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702464002 2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705450080 2.54mm Pitch SL™ Header, Single Row Pocket Vertical, Shrouded, with Press-fir Plastic Peg, 11 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705430007 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, 8Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-1221 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
0702463001 2.54mm Pitch C-Grid® Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0443 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015800225 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705550050 2.54mm Pitch SL™ Header, Single Row, Right Angle, Pocket, Shrouded,with Press-fit Plastic Peg, 16 Circuits, 0.38μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0705410074 2.54mm Pitch SL™ Header, Single Row, Vertical, Pocket, Shrouded, with Beveled Plastic Peg, 5 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-80-0665 2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0015477668 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
15-91-3063 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 6 Circuits, 0.76μm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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