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SPACING 数据表, PDF

ALL 3M Electronics(3)A-BRIGHT Inc(4)Adam Technologies, Inc.(3)American Zettler, Inc.(1)Aries Electronics, Inc.(2)Bourns Electronic Solutions(1)CONEC Elektronische Bauelemente GmbH(3)Cornell Dubilier Electronics(1)DB Lectro Inc(2)Dubilier(1)EDAC, All Rights Reserved.(202324)EPCOS(1)EXCEL CELL ELECTRONIC CO., LTD.(11)
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搜索关键字 : 'SPACING' - 的资料共: 3592 (1/180) Pages
制造商部件名数据表功能描述
Company Logo Img
Kemet Corporation 		C901U500JZSDDAWL35 Datasheet pdf image
57Kb/1P		 Ceramic, Safety, C900_Z, 50 pF, 5%, SL, Lead Spacing = 10mm
C911U750JZSDAAWL45 Datasheet pdf image
55Kb/1P		 Ceramic, Safety, C900_Z, 75 pF, 5%, SL, Lead Spacing = 10mm
C935U101JYSDBAWL45 Datasheet pdf image
57Kb/1P		 Ceramic, Safety, C900_Y, 100 pF, 5%, SL, Lead Spacing = 5mm
ERP610W222MERY Datasheet pdf image
84Kb/1P		 Ceramic, Safety, ERP610, 2200 pF, 20%, Y5U, Lead Spacing = 12.5mm
C961U222MWWDAAWL20 Datasheet pdf image
56Kb/1P		 Ceramic, Safety, C900_W, 2200 pF, 20%, Y5U, Lead Spacing = 10mm
ERP610W471MDRU Datasheet pdf image
78Kb/1P		 Ceramic, Safety, ERP610, 470 pF, 20%, Y5U, Lead Spacing = 10mm
C907U102MYVDBA7317 Datasheet pdf image
57Kb/1P		 Ceramic, Safety, C900_Y, 1000 pF, 20%, Y5V, Lead Spacing = 7.5mm
C907U102MYWDBA7317 Datasheet pdf image
57Kb/1P		 Ceramic, Safety, C900_Y, 1000 pF, 20%, Y5U, Lead Spacing = 7.5mm
C907U222MZVDBA7317 Datasheet pdf image
57Kb/1P		 Ceramic, Safety, C900_Z, 2200 pF, 20%, Y5V, Lead Spacing = 7.5mm
C961U682MZVDBA7317 Datasheet pdf image
59Kb/1P		 Ceramic, Safety, C900_Z, 6800 pF, 20%, Y5V, Lead Spacing = 10mm
C921U222MZWDBA7317 Datasheet pdf image
58Kb/1P		 Ceramic, Safety, C900_Z, 2200 pF, 20%, Y5U, Lead Spacing = 10mm
C921U152MVWDBA7317 Datasheet pdf image
58Kb/1P		 Ceramic, Safety, C900_V, 1500 pF, 20%, Y5U, Lead Spacing = 10mm
C927U152MZWDBA7317 Datasheet pdf image
58Kb/1P		 Ceramic, Safety, C900_Z, 1500 pF, 20%, Y5U, Lead Spacing = 7.5mm
C921U152MZWDBA7317 Datasheet pdf image
58Kb/1P		 Ceramic, Safety, C900_Z, 1500 pF, 20%, Y5U, Lead Spacing = 10mm
C921U152MUWDBA7317 Datasheet pdf image
58Kb/1P		 Ceramic, Safety, C900_U, 1500 pF, 20%, Y5U, Lead Spacing = 10mm
C921U222MYWDBA7317 Datasheet pdf image
58Kb/1P		 Ceramic, Safety, C900_Y, 2200 pF, 20%, Y5U, Lead Spacing = 10mm
ERP610W102MEF0 Datasheet pdf image
83Kb/1P		 Ceramic, Safety, ERP610, 1000 pF, 20%, Y5U, Lead Spacing = 12.5mm
C907U102MZWDAA7317 Datasheet pdf image
56Kb/1P		 Ceramic, Safety, C900_Z, 1000 pF, 20%, Y5U, Lead Spacing = 7.5mm
C931U222MVWDBA7317 Datasheet pdf image
58Kb/1P		 Ceramic, Safety, C900_V, 2200 pF, 20%, Y5U, Lead Spacing = 10mm
C961U392MVWDBA7317 Datasheet pdf image
58Kb/1P		 Ceramic, Safety, C900_V, 3900 pF, 20%, Y5U, Lead Spacing = 10mm

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什么是 SPACING

在电子组件中，“间距”是指组件之间的间距。

如果零件之间的间距不够，则可能在零件之间发生电相互作用或热问题。

例如，在印刷电路板（PCB）设计中，必须充分考虑组件之间的间距。

如果组件之间的间距太小，则可能发生电噪声或电气相互作用，这可能会降低PCB的信号质量或导致缺陷。

另外，如果零件之间的差距很小，则热量扩散可能无法充分执行，并且零件可能过热。

由于这些问题可以降低电路的可靠性和寿命，因此必须在设计阶段正确考虑零件之间的间距。

因此，在设计电子组件时，重要的是要完全考虑组件之间的间距。

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。


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