制造商 | 部件名 | 数据表 | 功能描述 |
TDK Electronics
|
CGA5L3X7R2E333K160AA |
338Kb/30P |
SPECIFICATION |
CGA3E2X7R2A103K080AA |
365Kb/31P |
SPECIFICATION |
HHM1562B |
50Kb/2P |
MULTILAYER BALUN SPECIFICATION |
HHM1570B1 |
51Kb/2P |
MULTILAYER BALUN SPECIFICATION |
HHM1517 |
59Kb/2P |
MULTILAYER BALUN SPECIFICATION |
MPU-6500 |
772Kb/40P |
MPU-6500 Product Specification Revision 1.1 03/05/2014 |
C1608X7S2A104MT |
104Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
C2012X7S2A105MT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
C3216X7S2A225MT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
C3225X7S2A335KT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
C5750X7S2A106MT |
104Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
C1005X7S2A103MT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
C1608X7S2A104KT |
104Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
C4532X7S2A475MT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
C1005X7S2A103KT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
C2012X7S2A105KT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
C3216X7S2A225KT |
104Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
C3225X7S2A335MT |
105Kb/1P |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS |
WR-383250-17M2-G |
364Kb/8P |
Please sign back specification after customer conformation until 2weeks. |
WR-483250-15M2-G |
334Kb/8P |
Please sign back specification after customer conformation until 2weeks. |