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THICKNESS 数据表, PDF

搜索关键字 : 'THICKNESS' - 的资料共: 18 (1/1) Pages
制造商部件名数据表功能描述
Company Logo Img
Molex Electronics Ltd.
0467200016 Datasheet pdf image
1Mb/14P
0.80 mm (.031") Pitch EdgeLine??12.5 Gbps Edge Card Connector, 108 Circuits, PCB Mating Thickness 1.57mm (.062")
0462070024 Datasheet pdf image
295Kb/4P
4.20mm (.165") Pitch Mini-Fit RTC??Reflow High Temperature Compatible Header, Dual Row, Vertical, 24 Circuits, 1.57mm (.062") PCB Thickness, with PCB Pegs
0440680273 Datasheet pdf image
239Kb/4P
4.20mm (.165") Pitch Mini-Fit BMI??Surface Mount Compatible Header, Dual Row, Vertical, 18 Circuits, 6.35mm (.250") PCB Thickness, with Snap-In Metal Pins
0438100371 Datasheet pdf image
409Kb/4P
4.20mm (.165") Pitch Mini-Fit BMI??Surface Mount Compatible Header, Dual Row, Right Angle, 18 Circuits, 6.35mm (.250") PCB Thickness, with Snap-In Metal Pins
0438100364 Datasheet pdf image
409Kb/4P
4.20mm (.165") Pitch Mini-Fit BMI??Surface Mount Compatible Header, Dual Row, Right Angle, 4 Circuits, 6.35mm (.250") PCB Thickness, with Snap-In Metal Pins
0462071004 Datasheet pdf image
264Kb/4P
4.20mm (.165") Pitch Mini-Fit RTC??Reflow High Temperature Compatible Header,Dual Row, Vertical, 4 Circuits, 1.57mm (.062") PCB Thickness, No PCB Pegs, LCP Housing
0482026062 Datasheet pdf image
147Kb/3P
D-Subminiature Shielded I/O PCB Male Plug, Right Angle, Through Hole, 9 Circuits,#4-40 Flush Insert, Screw Hole, Threaded, Gold (Au) Flash, PCB Thickness 1.60mm (.063")
0480372001 Datasheet pdf image
128Kb/3P
Universal Serial Bus (USB) Shielded I/O Plug, Type A, Right Angle, Surface Mount,0.76關m (30關") Gold (Au) Plating, PCB Thickness 1.60mm (.063"), Tape on Reel Package
0438100360 Datasheet pdf image
409Kb/4P
4.20mm (.165") Pitch Mini-Fit BMI??Surface Mount Compatible Header, Dual Row,Right Angle, 18 Circuits, 6.35mm (.250") PCB Thickness, with Snap-In Metal Pins, PA Polyamide Nylon 4/6
0438100356 Datasheet pdf image
409Kb/4P
4.20mm (.165") Pitch Mini-Fit BMI??Surface Mount Compatible Header, Dual Row,Right Angle, 10 Circuits, 6.35mm (.250") PCB Thickness, with Snap-In Metal Pins, PA Polyamide Nylon 4/6
0482026142 Datasheet pdf image
144Kb/3P
D-Subminiature Shielded I/O PCB Male Plug, Right Angle, Through Hole, 15Circuits,#4-40 Flush Insert, 0.76關m (30關") Gold (Au) Plating, PCB Thickness 1.60mm (.063"), Lead Free
0482016152 Datasheet pdf image
148Kb/3P
D-Subminiature Shielded I/O PCB Female Receptacle, Right Angle, Through Hole, 15 Circuits, #4-40Flush Insert, Screw Hole, Threaded, 0.38關m (15關") Gold (Au) Plating, PCB Thickness 1.60mm (.063")
0462070004 Datasheet pdf image
295Kb/4P
4.20mm (.165") Pitch Mini-Fit RTC??Reflow High Temperature Compatible Header,Dual Row, Vertical, 4 Circuits, 1.57mm (.062") PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating
0462070010 Datasheet pdf image
295Kb/4P
4.20mm (.165") Pitch Mini-Fit RTC??Reflow High Temperature Compatible Header,Dual Row, Vertical, 10 Circuits, 1.57mm (.062") PCB Thickness, with PCB Pegs, LCP Housing, with Tin (Sn) Over Nickel (Ni) Plating
0482016048 Datasheet pdf image
152Kb/3P
D-Subminiature Shielded I/O PCB Female Receptacle, Right Angle, Through Hole, 9 Circuits, 2 pcs M3 Inner Thread Screw Attached, 0.76關m (30關") Gold (Au) Plating, PCB Thickness 1.60mm (.063")
0480372300 Datasheet pdf image
133Kb/3P
Universal Serial Bus (USB) Shielded I/O Plug, Type A, Right Angle, Surface Mount,Straight Tab 4.80mm (.189"), 0.76關m (30關") Gold (Au) Plating, with Dummy Cap, PCB Thickness 1.20mm (.047")
0482016061 Datasheet pdf image
153Kb/3P
D-Subminiature Shielded I/O PCB Female Receptacle, Right Angle, Through Hole, 9 Circuits, 2 pcs #4-40 Round Inner Thread Screw Rivetted, BeveledMetal Pins, Gold (Au) Flash, PCB Thickness 1.60mm (.063"), Lead Free
0482016366 Datasheet pdf image
153Kb/3P
D-Subminiature Shielded I/O PCB Female Receptacle, Right Angle, Through Hole, 25 Circuits, #4-40 Flush Insert, 2 #4-40 Hex Internal Thread Screws Included, Gold (Au) Flash, PCB Thickness 1.60mm (.063"), Lead Free

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什么是 THICKNESS


在电子零件中,厚度是指零​​件或元素的厚度。

在电子组件中,厚度在组件或设备的功能和性能中起重要作用。

例如,在半导体设备中,半导体盘的厚度起着重要作用。

在半导体设备中,原始板的厚度越低,可以形成层越细,因此可以改善电气特性。

相反,层越厚,可以形成越多的层,从而改善了设备的性能。

另外,由于电子组件的厚度是标准化的,因此必须观察到标准化的厚度。

例如,在PCB(印刷电路板)中,PCB的厚度是标准化的,因此有必要选择和使用与组件或元素厚度匹配的PCB。

在电子组件中,厚度是决定组件或设备功能和性能的重要因素之一。

因此,对厚度和技术改进的研究是在电子零件中不断进行的。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。


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