制造商 | 部件名 | 浏览 | 功能描述 |

National Semiconductor ...
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D16D |
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16 Lead Hybrid Metal Can Dual-in-Line Package NS Package Number D16D |

Zetex Semiconductors
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SOD523 |
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Surface mounted, 2 pin package Package outline |

National Semiconductor ...
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MC28B |
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28 Lead Ceramic Small Outline Package, EPROM NS Package |

Lite-On Technology Corp...
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LTSN-H213EGBW |
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ROHS/ Package in 8mm tape on 7" diameter reels/ EIA STD package |

Integrated Circuit Syst...
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MK2761A |
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Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body) |

Vectron International, ...
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C4550 |
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OCXO Surface Mount Package Optional Reflow Process Compatible Optional AT-Cut and SC-Cut Crystal Options Low Profile Compact Package |

Texas Instruments
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TDA2SX_V01 |
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TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0 |

Fairchild Semiconductor
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MSA20 |
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20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 |

Vectron International, ...
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C4505 |
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OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Compact Package |

Texas Instruments
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TDA2E-17 |
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SoC for Advanced Driver Assistance Systems (ADAS) 17mm Package (CBD Package) |
LP3982ILD-ADJ |
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MAX8860 Pin, Package and Spec. Compatible, WSON Space Saving Package |

Sharp Electrionic Compo...
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PC411L0YIP0F |
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High Speed 15Mb/s, High CMR Mini-flat Package OPIC Mini-flat Package ∗OPIC |

National Semiconductor ...
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MC16A |
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16 Lead Ceramic Small Outline Package NS Package Number MC16A |

Abracon Corporation
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ASDM1-100.000MHZ-LC-T |
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ULTRA MINIATURE PLASTIC PACKAGE ULTRA MINIATURE PLASTIC PACKAGE |

National Semiconductor ...
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MTC16 |
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16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16 |

Continental Device Indi...
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TO-263 |
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TO-263 D PAK SMD Plastic Package Package Outline and Packaging Information |

Hamamatsu Corporation
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S9648-100 |
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Plastic package shaped the same as metal package |

Shindengen Electric Mfg...
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S20WB60_17 |
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Square In-line Package (Input/Output In-line Package) |

Texas Instruments
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TDA2EG-17 |
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SoC for Advanced Driver Assistance Systems (ADAS) 17mm Package (CBD Package) Silicon Revision 2.0 |
TDA2-17 |
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ADAS Applications Processor 17mm Package (AAS Package) Silicon Revision 2.0 |