| 制造商 | 部件名 | 浏览 | 功能描述 |
National Semiconductor ...
|
D16D |
 |
16 Lead Hybrid Metal Can Dual-in-Line Package NS Package Number D16D |
Zetex Semiconductors
|
SOD523 |
|
Surface mounted, 2 pin package Package outline |
National Semiconductor ...
|
MC28B |
|
28 Lead Ceramic Small Outline Package, EPROM NS Package |
Lite-On Technology Corp...
|
LTSN-H213EGBW |
|
ROHS/ Package in 8mm tape on 7" diameter reels/ EIA STD package |
Integrated Circuit Syst...
|
MK2761A |
|
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body) |
Vectron International, ...
|
C4550 |
|
OCXO Surface Mount Package Optional Reflow Process Compatible Optional AT-Cut and SC-Cut Crystal Options Low Profile Compact Package |
Texas Instruments
|
TDA2SX_V01 |
|
TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0 |
Fairchild Semiconductor
|
MSA20 |
|
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 |
Vectron International, ...
|
C4505 |
|
OCXO Surface Mount Package Reflow Process Compatible AT-Cut and SC-Cut Crystal Options Compact Package |
Texas Instruments
|
TDA2E-17 |
|
SoC for Advanced Driver Assistance Systems (ADAS) 17mm Package (CBD Package) |
| LP3982ILD-ADJ |
|
MAX8860 Pin, Package and Spec. Compatible, WSON Space Saving Package |
Sharp Electrionic Compo...
|
PC411L0YIP0F |
|
High Speed 15Mb/s, High CMR Mini-flat Package OPIC Mini-flat Package ∗OPIC |
National Semiconductor ...
|
MC16A |
|
16 Lead Ceramic Small Outline Package NS Package Number MC16A |
Abracon Corporation
|
ASDM1-100.000MHZ-LC-T |
|
ULTRA MINIATURE PLASTIC PACKAGE ULTRA MINIATURE PLASTIC PACKAGE |
National Semiconductor ...
|
MTC16 |
|
16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16 |
Continental Device Indi...
|
TO-263 |
|
TO-263 D PAK SMD Plastic Package Package Outline and Packaging Information |
Hamamatsu Corporation
|
S9648-100 |
|
Plastic package shaped the same as metal package |
Shindengen Electric Mfg...
|
S20WB60_17 |
|
Square In-line Package (Input/Output In-line Package) |
Texas Instruments
|
TDA2EG-17 |
|
SoC for Advanced Driver Assistance Systems (ADAS) 17mm Package (CBD Package) Silicon Revision 2.0 |
| TDA2-17 |
|
ADAS Applications Processor 17mm Package (AAS Package) Silicon Revision 2.0 |
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